It is used for the removal of inner dry film, outer dry film and ENIG selective dry film during PCB manufacturing, and in particular applicable to the removal of dry film for fine circuit, and applies to the film removal for IC substrate and MSAP process.
Free of caustic soda, free of impact on tin surface and solder mask ink;
Free of oxidation on copper surface and gold surface;
Film broken into small particles to prevent wrapping roller and blocking nozzle;
High film removal rate, more than 1x faster than NaOH;
Bath life can be extended more than 10X than NaOH;
Applicable to film removal for IC substrate and MSAP process.