Hole Conduction Process

It refers to electroless copper for vertical equipment, and serves for the deposition of a uniform layer of copper on hole of circuit board by chemical method to realize metallization for hole and provide copper plating with conduction conditions.

Advantage introduction:

Applicable to production demands for the boards with high aspect ratio and HDI, PTH bath load has wide applicable scope;
Stable PTH with high performance, compact PTH crystallization, good backlight effect;
PTH layer has good adhesive force and high thermal shock resistance;
PTH bath solution has low wastewater overflow, and is uneasy for copper sedimentation, indicating long maintenance period and good environmental friendliness.
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