Surface Finishing

New-generation selective OSP refers to the product in particular designed for PCB surface coating and adapted to high-temperature lead-free assembly process, applies to full-copper board and copper-gold mixed board, with no film deposition on gold surface, and highly applies to the production of high-density and fine-spacing PCB.

Advantage introduction:

Excellent tin adhesion performance;
Excellent tin climb performance for DIMM through hole;
Good selectivity, no deposition while the gold thickness is relative thin;
Good compatibility for flux;
Good solution stability.
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