Surface Finishing

Immersion silver, as a lead-free PCB finished surface treatment process, serves for depositing a layer of silver with thickness of 6~16μ inch on copper surface through replacement reaction to ensure flat surface; it has good conductivity and solderability.

Advantage introduction:

Smooth surface, suitable for package of SMD and BGA;
Standard surface for Au-wire & Al-wire bond, can replace electroplating nickel/gold or ENIG;
Can replace electroplating nickel or silver for bonding, good reflexes as surface;
Good electroconductivity for contact conduction application;
Low risk of electromigration and low galvanic effect.
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